Find the most up-to-date version of IPC-2222 at Engineering360. If a conflict of requirements exist between IPC-2222 and those listed below, IPC-2222 takes precedence. The revision of the document in effect at the time of solicitation shall take precedence. 2.1 Institute for Interconnecting and Packaging Electronic Circuits (IPC)1 IPC-EG-140. Interpretation shall be in accordance with the generic standard. Mot 057 Nana Haruno.

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Scope: This standard establishes the specific requirements for the design of rigid organic printed boards. Purpose The requirements contained herein are intended to establish specific design details that shall be used in conjunction with IPC-2221 to produce designs intended to mount and attach components. The components may be through-hole, surface mount, fine pitch, ultra-fine pitch, array mounting or unpackaged bare die. The organic materials may be homogeneous, reinforced, or used in combination with inorganic materials; the interconnections may be single, double, or multilayered. They may be any combination able to perform the physical, thermal, environmental, and electronic function.

Document Hierarchy Document hierarchy shall be in accordance with the generic standard IPC-2221. Presentation Presentation shall be in accordance with the generic standard IPC-2221. Driver D-link V90 Analog External Modem. Interpretation Interpretation shall be in accordance with the generic standard IPC-2221.

Definition of Terms The definition of all terms used herein shall be in accordance with IPC-T-50 and as defined in 1.5.1. As Agreed Between User and Supplier (AABUS) Indicates additional or alternate requirements to be decided between the user and the supplier in the procurement documentation.

Examples include contractual requirements, modifications to purchase documentation and information on the drawing. Agreements can be used to define test methods, conditions, frequencies, categories or acceptance criteria within a test, if not already established. Classification of Products Classification of products shall be in accordance with the generic standard IPC-2221 and as defined in 1.6.1. Printed Board Type This standard provides design information for different printed board types. Printed board types are classified as: Type 1 — Single-Sided Printed Board Type 2 — Double-Sided Printed Board Type 3 — Multilayer Board without Blind or Buried Vias Type 4 — Multilayer Board with Blind and/or Buried Vias Type 5 — Multilayer Metal-Core Board without Blind or Buried Vias Type 6 — Multilayer Metal-Core Board with Blind and/or Buried Vias Applicability The contents of this standard may not apply to certain leading edge technologies.

Refer to IPC-2221 for additional information. Revision Level Changes Changes that were incorporated in the current revision of this specification are indicated throughout by gray shading of the relevant subsection(s). Changes to a figure or table are indicated by gray shading of the Figure or Table header. Organization: Association Connecting Electronics Industries Document Number: ipc-2222 Publish Date: 2010-12-01 Page Count: 44 Available Languages: EN DOD Adopted: NO ANSI Approved: NO Most Recent Revision: YES Current Version: YES Status: Active. IHS Standards Expert subscription, simplifies and expedites the process for finding and managing standards by giving you access to standards from over 370 standards developing organizations (SDOs).