Model: Lam Rainbow 4520 SN3304. Mind Of A Murdere. Lam Rainbow 4420-Crated Read More; Lam Rainbow 4400B SN2357 Read More; Matrix105 -ID 4 Read More; LAM TCP9400 SE -40086. Lam Research Rainbow 4520 Dielectric Etch System SN 3401 • Currently Configured for 200mm Flat Wafers • Lam Envision Software Version E1.4.6-011.

Allwin21 Corp. Focuses on and professionally provides the following fully refurbished and customized Lam Research AutoEtch and Rainbow quipment with high Quality,rightCost,quick Delivery and excelentService for Semiconductor industry,MEMS, Biomedical, Nanotechnology,Solar,LEDs etc. Lam Rainbow 4420/4428 Lam Rainbow 4520/4528 Lam Rainbow 4620/4628 Lam Rainbow 4720/4728 Lam AutoEtch 490 Lam AutoEtch 590 Lam AutoEtch 690 Lam AutoEtch 790 Manufacturer:Lam Research Condition:Used (Refurbished and warranty is available). Contact Us for more information. Championship Manager 2007 Completo Pch. Wafer Size Capacity:6 to 8 inch capacity System Description: The Rainbow 4420 is a fully automated, single-wafer plasma Polysilicon, Refractory metal silicides and Nitride etching system that processes 4-, 5-, 6-, or 8-inch wafers and features top powered electrode plate, programmable electrode spacing, and automatic wafer alignment and placement.

The Rainbow 4420XL etcher includes the above listed features, plus, a high efficiency magnetically levitated turbo pump.The Rainbow 4420 etcher comes with Envision operator interface.Designed for continuous operation, the Rainbow 4420/4420XL etcher is computer-controlled, allowing either manual or automatic control. Wafer Transport The wafer transport system is responsible for moving wafers through the system. It picks up a wafer from a cassette on the send indexer, centers and aligns it, transports it to the chamber for processing, and finally, when processing is complete, deposits it into a cassette on the receive indexer. Major assemblies in the wafer transport system include send and receive indexers, a load station that centers and aligns the wafer, and entrance and exit loadlocks with mechanical arms.

Operator Controls The operator controls consist of control panels with switches andindicator lights, and a computer-controlled operator interface that runs Envision software.The etcher uses software to control machine functions, record and run process recipes, and warn of conditions that require the attention of an operator or maintenance technician. Envision software has a graphical user interface (GUI) that employs a combination of icons, buttons, and selectable commands, together with detailed graphics. Please find the locations of the control panels, CRT display, and keyboard for the operator interface. The rear (auxiliary) control panel is located in the upper right corner, when facing the back of the etcher. On some Rainbow 4420/4420XL operator interfaces, an optional light pen is also provided. DESCRIPTION The Rainbow 4420 is a fully automated, microprocessor controlled in line, single wafer dry plasma/REI (reactive ion etching) system.

It has a pick and place, cassette to cassette wafer transport system with a capability of processing up to 8” (200mm) wafer size. FEATURES Microprocessor controlled and allows for manual or automatic operation Automatic non-contact wafer alignment for accurate wafer placement to process chamber Top or bottom powered parallel electrode plates for process versatility Programmable electrode spacing for RF power flexibility Unique RF matching network. Located on the upper and lower electrodes for programmable switching between plasma and RIE modes Multiple independent recipe steps with programmable values for optimizing process parameter End Point Detection for minimizing over/under etching 12 month warranty is optional. APPLICATION Polysilicon etch Nitride etch Refractory Metal Silicides etch SPECIFICATIONS 4” to 8” wafer capability 8 MFC gas positions: 99.998% gas purity, inlet pressure 20 psi, ¼” VCR and use in line.05u filter (CL2, Hbr, O2, SF6, He, CF4, Ar,HCl) N2 purge: 40 psi +/-5, 8SLM =/-2, ¼” VCR RF Generator, 13.56 Mhz freq.

At 600 watts FACILITIES Electrical: Etch Module: 208 VAC, 50/60 hz., 3 phase, 30A, 5 wire RF Cart: 208VAC, 50/60 hz., 3 phase, 30A 5 wire Dual Channel TCU: 208 VAC, 50/60hz., 3 phase, 30A CDA: 90 psi +/- 5, 3/8” OD Tubing (supplied to both Etch Module and RF cart Exhaust: Etch Module cab.: 300 cfm, 4” (10.2cm) OD sheet metal tubing and.5” of H2O Etch Module gas cabinet: 75 cfm, 2” (5.1cm) OD sheet metal tubing and.5” of H2O Scrubbed. PCW: RF generator: 2GPM +/-2, 85 +/-5 psi, 34 deg C +1/-20,3/8” ID tubing, 200u filter Dual Channel TCU: 6GPM +/.5.